SACE – Spark Assisted Chemical Engraving

DOWNLOAD + -

In order to download the PDF, please fill the information below.

Spark Assisted Chemical Engraving - SACE

  • Mass and flexible production: prototyping small series, batch '1 size'.
  • Modular concept with various number of possible configurations: 1 to 4 heads machine configuration.
  • High positioning accuracy and process stability.
  • Clean-room compatible.
  • Mask less process.
  • Low tooling costs.
  • Surface strengthening and texturing.
  • 2,5 D machining.
  • Burr and micro-crack free machining.

Machining specifications

  • 0.05 to 1.5 mm3/min/tool depending on the quality required.
  • Multitool technology : 1 to 36 tools possible per module

Applications

  • Medical industry
    • Microfluidic devices
    • Multi layer mixer
    • Lab-On-Chip
  • Watch industry
    • Watch dial glass
    • Mechanical parts
    • Decoration
  • Electronic industry
    • Drilling for Through Glass Vias (TGV)
    • Interposer
    • Optical PCB
    • Micro Electro Mechanical Systems (MEMS)

Quality and expertise

  • Scanning Electron Microscopy (SEM)
  • Rougness measurements
  • Optical measurements to control shape

Micro Machining

  • Hole diameter down to 80 μm
  • Glass transparency property not impacted
  • Without material deposit and no damages or burrs
  • Wall thickness / hole diameter ratio up to 10
  • Smooth and clear machined surfaces
  • No clean room facilities needed

Advanced drilling and routing functions

  • Glass:
    Pyrex, BF33, D263T, Mempax, AF32, B270
  • Tempered glass:
    Corning Gorilla, AGC Dragontrail, Schott Xensation, …
  • Quartz:
    Fused silica
  • Silicon

Specifications

  • Width machining:   > 50 µm
  • Ratio:  up to 1:5 (depending on the design)
  • Thickness:   30 µm up to 4 mm
  • Roughness:   Ra > 0,4 µm
  • Machining area:   220 x 220 mm
  • Chipping:   < 10 µm

Related Machines