SACE – Spark Assisted Chemical Engraving

Front view of the Posalux SACE machine with four modules
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    Posalux SACE machine four modules with dimensions

    Spark Assisted Chemical Engraving - SACE

    • Mass and flexible production: prototyping small series, batch '1 size'.
    • Modular concept with various number of possible configurations: 1 to 4 heads machine configuration.
    • High positioning accuracy and process stability.
    • Clean-room compatible.
    • Mask less process.
    • Low tooling costs.
    • Surface strengthening and texturing.
    • 2,5 D machining.
    • Burr and micro-crack free machining.
    Front view of the Posalux SACE machine with one module
    SACE modular concept, up to four modules

    Machining specifications

    • 0.05 to 1.5 mm3/min/tool depending on the quality required.
    • Multitool technology : 1 to 36 tools possible per module

    Applications

    • Medical industry
      • Microfluidic devices
      • Multi layer mixer
      • Lab-On-Chip
    • Watch industry
      • Watch dial glass
      • Mechanical parts
      • Decoration
    • Electronic industry
      • Drilling for Through Glass Vias (TGV)
      • Interposer
      • Optical PCB
      • Micro Electro Mechanical Systems (MEMS)

    Quality and expertise

    • Scanning Electron Microscopy (SEM)
    • Rougness measurements
    • Optical measurements to control shape

    Micro Machining

    • Hole diameter down to 80 μm
    • Glass transparency property not impacted
    • Without material deposit and no damages or burrs
    • Wall thickness / hole diameter ratio up to 10
    • Smooth and clear machined surfaces
    • No clean room facilities needed

    Advanced drilling and routing functions

    • Glass:
      Pyrex, BF33, D263T, Mempax, AF32, B270
    • Tempered glass:
      Corning Gorilla, AGC Dragontrail, Schott Xensation, …
    • Quartz:
      Fused silica
    • Silicon

    Specifications

    • Width machining:   > 50 µm
    • Ratio:  up to 1:5 (depending on the design)
    • Thickness:   30 µm up to 4 mm
    • Roughness:   Ra > 0,4 µm
    • Machining area:   220 x 220 mm
    • Chipping:   < 10 µm

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