Test fixture guide plates micro-drilling for IC substrates and bare boards testing industry
Micro-drilling of test fixture guide plates for IC substrates and bare boards testing faces the challenge of maintaining extreme precision and quality. With intricate IC and substrates designs, even slight inaccuracies can affect testing efficiency, risking unreliable results or device damage. Moreover, the evolving landscape of IC and substrates requires a constant adaptability in micromachining processes, making innovation a core necessity.
Micro-drilling of test fixture guide plates application overview
We process any kind of test fixture guide plates on a wide range of engineering plastics (S1000, PPS, Miproplate, etc.). Utilizing a process characterized by a high repetition rate and unmatched Laser beam quality, it promises exceptional repeatability in hole quality. This meticulous approach not only delivers unequaled productivity but also ensures a higher yield rate. Critically, the entire process is free from thermal effects (NAZ), safeguarding the integrity of the materials at every step.
A micro-drilling project for test fixtures guide plates demands a high degree of commitment on tight specifications. On this basis, our results meet (or exceed) market requirements:
- Drilling diameters down to 20 μm or less
- Positioning accuracy ± 2 μm
- Wall thickness (between to holes) < 10 μm
- Hole size accuracy < ± 2 μm
- Roundness default < 1.5 μm
- Aspect ratio 1:10 (or higher depending on material and hole shape)
You currently have a test fixture guide plates micro-drilling project and you would like to know waht we could achieve together?
The FEMTOsecond LASER technology is a perfect match for all industries requiring the highest precision without compromising quality and productivity.
Miniaturized components are used in all kind of devices. Several applications – e.g. in the electronics or MedTech world – are not imaginable without very small and tiny parts. Thus, this requires new ways to produce and manufacture these parts. With FEMTO LASER μ-machining there are various processes possible like drilling, cutting and turning. It's compatible with almost all materials that are otherwise very difficult to machine with conventional tools.
With each FEMTOsecond LASER pulse that hits the work-piece, a small amount of material immediately vaporizes. The material removal occurs in a controlled manner leading to no damage, burrs or any negative influences to the material integrity.
- FEMTOsecond Laser source < 300 fs
- Highest level of accuracy and productivity
- Stable and repeatable quality
- Cold ablation keeping material integrity (no HAZ)
- Proven performance in 24/7 industrial environment
FEMTOsecond LASER machines provide advanced µ-machining solutions for high-tech production. It ensures impeccable surface smoothness and precise machining without thermal residue.
Other applications that might be interesting for you
Turning of contacts pins for IC substrates testing industry
Turning of contact pins (wires, bars and tubes) for semiconductors testing industry
Drilling and routing of composites and non-ferrous materials for printed circuit boards (PCB) industry
Let’s discuss your micro-machining operations
If you are looking for a high-tech production system as well as a partner to process state-of-the-art micro-machining, you are in the right place.